Test Socket Burn in Socket Programming for Emmc Emcp Memory Nand Power IC with Package of BGA

Product Name: Test Socket, Burn in Socket, Programming for Emmc, Emcp, Memory, Nand, Power IC with Package of BGA, LGA, Qfn, Wlcsp Model NO.: 701-0000000 Pitch: 14X18mm Pin Count: 300 IC Size: 14X18mm Max Strcture: Clamshell Package: BGA, LGA, Qfn, Wlcsp Contact: Spring Probe Trademark: Sireda Transport Package: Carton Box Specification: Burn in Socket Origin: Shenzhen, China HS Code: 8536690000 Product Description Mold Socket for semeconductor test Socket, Burn in Socket, Programming Socket for eMMC, eMCP, Memory, NAND, Power IC with package of BGA, LGA, QFN, WLCSP-Compact size of the socket design, help to save space for burn in test.-High cost effective socket for IC chip production test or validation.-Suitable for eMMC, eMCP, Nand, Memory, Power IC, MEMS IC, etc.-Suitable for different kind of package like BGA, LGA, QFN, WLCSP, etc.-Support for PCB design and manufacturing.-Provide customized design for customer's requirement.MechanicalMaterial Socket Body: PEIContact: Pogo PinOperation Temperature: -40 ~120 ºCLife Span: 50K CyclesSpring Force: 20g ~30g per PinElectricalCurrent Rating: Min.1.2ADC Resistance: Max. 100mΩWe provide products with good quality and fast response, also provide customized service. If you like to learn more about us, please have alook at our website:www.sireda.com.