Test Socket Burn in Socket Programming for Emmc Emcp Memory Nand Power IC with Package of BGA

Product Name: Test Socket, Burn in Socket, Programming for Emmc, Emcp, Memory, Nand, Power IC with Package of BGA, LGA, Qfn, Wlcsp Model NO.: 701-0000000 Pitch: 14X18mm Pin Count: 300 IC Size: 14X18mm Max Strcture: Clamshell Package: BGA, LGA, Qfn, Wlcsp Contact: Spring Probe Trademark: Sireda Transport Package: Carton Box Specification: Burn in Socket Origin: Shenzhen, China HS Code: 8536690000 Product Description Mold Socket for semeconductor test Socket, Burn in Socket, Programming Socket for eMMC, eMCP, Memory, NAND, Power IC with package of BGA, LGA, QFN, WLCSP-Compact size of the socket design, help to save space for burn in test.-High cost effective socket for IC chip production test or validation.-Suitable for eMMC, eMCP, Nand, Memory, Power IC, MEMS IC, etc.-Suitable for different kind of package like BGA, LGA, QFN, WLCSP, etc.-Support for PCB design and manufacturing.-Provide customized design for customer's requirement.MechanicalMaterial Socket BodyPEIContactPogo PinOperation Temperature-40 ~120 ºCLife Span50K CyclesSpring Force20g ~30g per PinElectricalCurrent RatingMin.1.2ADC ResistanceMax. 100mΩWe provide products with good quality and fast response, also provide customized service. If you like to learn more about us, please have alook at our website:www.sireda.com.