Multi Layer Immersion Gold PCB

Product Name: Multi Layer Immersion Gold PCB Model NO.: Okey-am-0523-24 Model: PCB Insulation Materials: Organic Resin base Material: Aluminum Processing Technology: Electrolytic Foil Mechanical Rigid: Rigid Flame Retardant Properties: V0 Material: Fiberglass Epoxy Dielectric: FR-4 Type: Rigid Circuit Board Color: Green, Blue, Black, Red, Yellow etc. Surface Finish: Lead Free HASL Number of Layers: Multilayer Surface Finihsing: Immersional Gold Condition: Original Made PCB Testing: E-Testing; Flying Probe Testing Board Thickness: 1.2~2.0mm Trademark: OKEY Transport Package: Inner Vacuum Packing Outer Carton Box Specification: UL, Rohs, ISO9001 SGS and Reach Origin: Shenzhen, Guangdong, China HS Code: 8534009000 Product Description ItemsSpeci.Max panel size32" x 20.5"(800mm x 520mm)Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)Min PAD (inner layer)5 mil(0.13mm)Min thickness(inner layer)4 mil(0.1mm)Inner copper thickness1~4 ozOuter copper thickness0.5~6 ozFinished board thickness0.4-3.2 mmBoard thickness tolerance control±0.10 mm±0.10 mm±10%±10%±10%±10%Inner layer treatmentbrown oxidationLayer count Capability1-30 LAYERalignment between ML±2milMin drilling0.15 mmMin finished hole0.1 mmHole precision±2 mil(±50 um)tolerance for Slot±3 mil(±75 um)tolerance for PTH±3 mil(±75um)tolerance for NPTH±2mil(±50um)Max Aspect Ratio for PTH08:01Hole wall copper thickness15-50umAlignment of outer layers4mil/4milMin trace width/space for outer layer4mil/4milTolerance of Etching+/-10%Thickness of solder maskon trace0.4-1.2mil(10-30um)at trace corner≥0.2mil(5um)On base material≤+1.2mil Finished thicknessHardness of solder mask6HAlignment of solder mask film±2mil(+/-50um)Min width of solder mask bridge4mil(100um)Max hole with solder plug0.5mmSurface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.Max Nickel thickness for Gold finger280u"(7um)Max gold thickness for Gold finger30u"(0.75um)Nickel thickness in Immersion Gold120u"/240u"(3um/6um)Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um)Impedance control and its tolerance50±10%,75±10%,100±10% 110±10%Trace Anti-stripped strength≥61B/in(≥107g/mm)bow and twist0.75%Double sided pcb board with osp finish:Place of Origin Guangdong, China (Mainland)Brand Name OKEYModel Number okey pcbbase Material FR-4Copper Thickness 1 OZBoard Thickness 1.2 mmMin. Hole Size 0.4mmMin. Line Width 0.2mmMin. Line Spacing 0.15mmSurface Finishing HASLColor redSmall order acceptableFire resistanceUL-94V0Outline/contourmilling, V-cut, CNC Routing100% productsE-test or flying probe testFeaturesThin board capabilitiesIncrease routing density in complicated desigExcellent mounting stability and reliabilityQualified material and surface treatment for Lead-free processApplicationsSmartphone, Feature Phone, Tablet, Ultrabook, e-Reader, MP3 Player, GPS, Portable Game Console, DSC, Camcorder, LCD ModuleBenefitsWell experienced manufacturer with good yielMultiple plants increase production output in short timeNOItemTechnical capabilities1Layers1-20 layers2Max. Board size2000×610mm3Min. board Thickness2-layer 0.15mm4-layer 0.4mm6-layer 0.6mm8-layer 1.5mm10-layer 1.6~2.0mm4Min. line Width/Space0.1mm(4mil)5Max. Copper thickness10OZ6Min. S/M Pitch0.1mm(4mil)7Min. hole size0.2mm(8mil)8Hole dia. Tolerance (PTH)±0.05mm(2mil)9Hole dia. Tolerance (NPTH)+0/-0.05mm(2mil)10Hole position deviation±0.05mm(2mil)11Outline tolerance±0.10mm(4mil)12Twist & Bent0.75%13Insulation Resistance>10 12 Ω Normal14Electric strength>1.3kv/mm15S/M abrasion>6H16Thermal stress288°C 10Sec17Test Voltage50-300V18Min. blind/buried via0.15mm (6mil)19Surface FinishedHAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold20MaterialsFR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base