详细说明
Product Name: High Quality Fr4 Multilayer PCB Printed Circuit Board Manufacturer Model NO.: okey Insulation Materials: Organic Resin base Material: Aluminum Processing Technology: Electrolytic Foil Mechanical Rigid: Rigid Flame Retardant Properties: V0 Application: Medical Instruments Material: Fiberglass Epoxy Dielectric: FR-4 Type: Rigid Circuit Board Sales Service: 24 Hours online Service Order Acceptable: Sample Order and Small Order Engineer Service: Copy PCB Gerber File Transport Package: Inner Vacuum Packed Outside in Carton Specification: 4 layers PCB with carbon HASL or immersion Gold Origin: Shenzhen City, China HS Code: 8534009000 Product Description Technical CapabilitiesItemsSpeci.RemarkMax panel size32" x 20.5"(800mm x 520mm)Max. Board size2000×610mmMin. board Thickness2-layer 0.15mm4-layer 0.4mm6-layer 0.6mm8-layer 1.5mm10-layer 1.6~2.0mmMin. line Width/Space0.1mm(4mil)Max. Copper thickness10OZMin. S/M Pitch0.1mm(4mil)Min. hole size0.2mm(8mil)Hole dia. Tolerance (PTH)±0.05mm(2mil)Hole dia. Tolerance,+0/-0.05mm(2mil)Hole position deviation±0.05mm(2mil)Outline tolerance±0.10mm(4mil)Twist & Bent0.75%Insulation Resistance>10 12 Ω NormalElectric strength>1.3kv/mmS/M abrasion>6HThermal stress288°C 10SecTest Voltage50-300VMin. blind/buried via0.15mm (6mil)Surface FinishedHASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating goldMaterialsFR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper baseMin trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)Min PAD (inner layer)5 mil(0.13mm)hole ring widthMin thickness(inner layer)4 mil(0.1mm)without copperInner copper thickness1~4 ozOuter copper thickness0.5~6 ozFinished board thickness0.4-3.2 mmBoard thickness tolerance control±0.10 mm±0.10 mm1~4 L±10%±10%6~8 L±10%±10%≥10 LInner layer treatmentbrown oxidationLayer count Capability1-30 LAYERalignment between ML±2milMin drilling0.15 mmMin finished hole0.1 mmHole precision±2 mil(±50 um)tolerance for Slot±3 mil(±75 um)tolerance for PTH±3 mil(±75um)tolerance for NPTH±2mil(±50um)Max Aspect Ratio for PTH08:01Hole wall copper thickness15-50umAlignment of outer layers4mil/4milMin trace width/space for outer layer4mil/4milTolerance of Etching+/-10%Thickness of solder maskon trace0.4-1.2mil(10-30um)at trace corner≥0.2mil(5um)On base material≤+1.2milFinished thicknessHardness of solder mask6HAlignment of solder mask film±2mil(+/-50um)Min width of solder mask bridge4mil(100um)Max hole with solder plug0.5mmSurface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger,Electric Gold, OSP, Immersion Silver.Max Nickel thickness for Gold finger280u"(7um)Max gold thickness for Gold finger30u"(0.75um)Nickel thickness in Immersion Gold120u"/240u"(3um/6um)Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um)Impedance control and its tolerance50±10%,75±10%,100±10% 110±10%Trace Anti-stripped strength≥61B/in(≥107g/mm)bow and twist0.75%
