详细说明
Product Name: F1 Solution, BGA153 Ufs Test Socket_11.5X13mm with F1 Interposer, Test Fixture, Compatible Bag153, Removable Lid, with Pinout, Mini Socket Model NO.: 702-0000953 Pitch: 0.5mm Pin Count: 153 Chip Size: 11.5X13mm Structure: Dt Removalbe Package: BGA Contact: Spring Probe Trademark: Sireda Transport Package: Carton Box Specification: UFS BGA153 11.5x13mm Origin: Shenzhen, China HS Code: 8536690000 Product Description F1 solution -UFS BGA153 Test Socket with F1 interposer-F1solution is designed to avoid problems of pad co-planarity, oxidation and damage of PCB board after de- soldering.-This solution is patented.-The compact, surface mount design requires no tooling, no extra place or mounting holess in the target PC board.-Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy maintenance.-Fully removable double latch turning lid is good for both manual and automatic operation.-Pinoutfor extra test or monitoring.-Mini socket sizes similar to IC chip size.MechanicalMaterial Socket Body: PEEK CeramicMaterial Socket Lid: AL, Cu, POMContact: Pogo PinOperation Temperature: -40 ~120 ºCLife Span: 50K CyclesSpring Force: 20g ~30g per PinSolder Ball: 96.5Sn/3.0Ag/0.5Cu (SAC305)ElectricalCurrent Rating: Min.1.2ADC Resistance: Max. 100mΩWe provide products with good quality and fast response, also provide customized service. If you like to learn more about us, please have alook at our website:www.sireda.com..
