Description
Product Name: Multi-Layer PCB/PCBA Design and Engineering Services Model NO.: Okey-am-088 Material: Fr4 Mechanical Rigid: Rigid Application: Consumer Electronics Processing Technology: Electrolytic Foil Insulation Materials: Organic Resin base Material: Copper Dielectric: FR-4 Flame Retardant Properties: V0 Type: Rigid Circuit Board Color: Green, Blue, Black, Red, Yellow etc. Trademark: OKEY Transport Package: Inner Vacuum Packed Outside in Carton Specification: UL ISO RoHS, REACH Origin: Guangdong Shenzhen, China HS Code: 8534009000 Product Description Technical CapabilitiesItemsSpeci.RemarkMax panel size32" x 20.5"(800mm x 520mm)Max. Board size2000×610mmMin. board Thickness2-layer 0.15mm4-layer 0.4mm6-layer 0.6mm8-layer 1.5mm10-layer 1.6~2.0mmMin. line Width/Space0.1mm(4mil)Max. Copper thickness10OZMin. S/M Pitch0.1mm(4mil)Min. hole size0.2mm(8mil)Hole dia. Tolerance (PTH)±0.05mm(2mil)Hole dia. Tolerance,+0/-0.05mm(2mil)Hole position deviation±0.05mm(2mil)Outline tolerance±0.10mm(4mil)Twist & Bent0.75%Insulation Resistance>10 12 Ω NormalElectric strength>1.3kv/mmS/M abrasion>6HThermal stress288°C 10SecTest Voltage50-300VMin. blind/buried via0.15mm (6mil)Surface FinishedHASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating goldMaterialsFR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper baseMin trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)Min PAD (inner layer)5 mil(0.13mm)hole ring widthMin thickness(inner layer)4 mil(0.1mm)without copperInner copper thickness1~4 ozOuter copper thickness0.5~6 ozFinished board thickness0.4-3.2 mmBoard thickness tolerance control±0.10 mm±0.10 mm1~4 L±10%±10%6~8 L±10%±10%≥10 LInner layer treatmentbrown oxidationLayer count Capability1-30 LAYERalignment between ML±2milMin drilling0.15 mmMin finished hole0.1 mmDouble sided pcb board with osp finish:Place of Origin Guangdong, China (Mainland)Brand Name OKEYModel Number okey pcbbase Material FR-4Copper Thickness 1 OZBoard Thickness 1.2 mmMin. Hole Size 0.4mmMin. Line Width 0.2mmMin. Line Spacing 0.15mmSurface Finishing HASLColor redSmall order acceptableFire resistanceUL-94V0Outline/contourmilling, V-cut, CNC Routing100% productsE-test or flying probe testFeaturesThin board capabilitiesIncrease routing density in complicated desigExcellent mounting stability and reliabilityQualified material and surface treatment for Lead-free processApplicationsSmartphone, Feature Phone, Tablet, Ultrabook, e-Reader, MP3 Player, GPS, Portable Game Console, DSC, Camcorder, LCD ModuleBenefitsWell experienced manufacturer with good yielMultiple plants increase production output in short timeNOItemTechnical capabilities1Layers1-20 layers2Max. Board size2000×610mm3Min. board Thickness2-layer 0.15mm4-layer 0.4mm6-layer 0.6mm8-layer 1.5mm10-layer 1.6~2.0mm4Min. line Width/Space0.1mm(4mil)5Max. Copper thickness10OZ6Min. S/M Pitch0.1mm(4mil)7Min. hole size0.2mm(8mil)8Hole dia. Tolerance (PTH)±0.05mm(2mil)9Hole dia. Tolerance (NPTH)+0/-0.05mm(2mil)10Hole position deviation±0.05mm(2mil)11Outline tolerance±0.10mm(4mil)12Twist & Bent0.75%13Insulation Resistance>10 12 Ω Normal14Electric strength>1.3kv/mm15S/M abrasion>6H16Thermal stress288°C 10Sec17Test Voltage50-300V18Min. blind/buried via0.15mm (6mil)19Surface FinishedHAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold20MaterialsFR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
