ZSH626 High Precision Dicing Saw for Semiconductor Wafer Cutting

Product Name: ZSH626 High Precision Dicing Saw for Semiconductor Wafer Cutting Model NO.: ZSH626 Condition: New Customized: Customized Power Source: Electricity Type: Fixed Brand: Hb Application: metal Saw Saw Type: Circular Saw Revolving Speed: 40000 Rpm Accuracy: 0.003mm Trademark: HB Transport Package: Wooden Case Specification: ISO9001 Origin: China HS Code: 8479899990 Product Description This ZSH626 Dicing Saw Machine is the upgrade model to replace the ZSH506. It has all advantages of ZSH506 model, also has the features of compact structure and higher level of configuration. These machines could widely applicated for dicing materials of Application field: Semiconductor chip, LED, IC, NTC, PCB, quartz and sapphire, photovoltaic wafer, lithium niobate, ceramic, gallium arsenide, glass, etc.The additional functions allowing this ZSH626 to dicing material structures as quadrilateral, hexagon, polygon with varies depth and division, customization is also available.SpecificationWork sizeΦ6" or6" squareDicing depthMax.4mm or customizationX-axisDriveServo motorStrokeMax240mmFeed rate0.1 - 200mm/sY-axisDriveStepper motor & rasterStrokeMax170mmY axis resolution0.0005mmAccuracy<0.003mm/5mmZ-axisDriveStepper motorStroke30mmResolution rate0.001mmRepeat accuracy±0.001mmθ-axisDrivedirect drive motorRotation range380°resolution ratio1.8″SpindlePower1.5kwSpeed3000~40000rphPanelOSWindowsOperation interfaceEnglish, touch-screenMicroscope magnification40× AutoMicroscope light-sourceLEDMachine parametersPower supplysingle phase 220ACV;3kwCompressed airpressure 0.55MPa, flow 200L/minCutting waterpressure 0.2~0.4MPa, flow 3L/minSpindel cooling waterpressure 0.2~0.4MPa, flow 1.5L/minDimension W*D*H675mm×885mm×1660mmWeight450KG