详细说明
Product Name: Turnkey Service PCBA Electronic Contract PCB Assembly Model NO.: P6130 Condition: New Customized: Customized Certification: RoHS, ISO base Material: FR-4 Layers: Double-Layer Mode of Production: SMT metal Coating: Gold Material: Fr4,Rogers,Aluminum,Ceramics Surface: Enig,HASL,OSP,Immersion Tin ,etc Min Hole: 0.005mm Copper: 0.5,1,2,3,4oz MOQ: 1PC Files Needed: Gerbers,Boms Prototype Lead Time: 5-7days Mass Lead Time: 7-15days Certificate: ISO9001,13485,IATF 16949,UL,RoHS Trademark: Suntek Transport Package: by ESD Pacakge Specification: 110*65mm Origin: China HS Code: 8573109090 Product Description Name:PCB fabrication and PCB assembly and PCB Circuit board factorySuntek is a professional PCBA solution provider,specilizes in PCB production,components procurement,PCBA assembly and a series service of wire harness and Box building.We have high-qualified management team, experienced R and D team and skilled employees and possess advantaged supply chain, commitment to quality and dedication to our customers and service.Welcome to send us Gerber file and BOM list for estimating at any timeYou will get our prompt reply in 24HPCB capabilities:ItemsParameterSpecialLayers Counts2-20Board materialFR-4,AluminumHighTg FR4max Fabrication area580×700mm500mm×3000mmBoard thickness0.1-3.2mmCamberDouble Sidemulti-layersd≤0.075mmd≤1%d≤0.05mmImpedance±7%±5%PTH toleranced>5.0±0.076mm0.3<d≤5.0±0.05mmd≤0.3±0.08mmMin finished hole size0.15mmHole copper thickness≥20umMin track width, spacing0.05mm×0.05mmProfile size±0.1mm±0.05mmProfileRouting,Punch,Cut,V-cut,ChanferSurface finishImmersion Gold:0.025~0.075umGold finger:≥0.13 um≥1.0 umOSP:0.2-0.5µmHAL:5~20 umLEADFREEHAL:5~20 umSurface platingSolder mask: Black Green White Red Thickness≥17um,Block,BGACharacter : Black Yellow Green White style: Highness≥0.0.625mm Width≥0.125mmPpeelable mask: red bule thickness≥300 umCarbonink : Black thickness≥25 um Highness≥0.30mm Width≥0.3mmPCBA capabilities:1)SMT assembly including BGA assembly2)Accepted SMD chips: 01005, BGA, QFP, QFN, TSOP3)Component height: 0.2-25mm4)Min packing: 02015)Min distance among BGA: 0.25-2.0mm6)Min BGA size: 0.1-0.63mm7)Min QFP space: 0.35mm8)Min assembly size: (X) 50 * (Y) 30mm9)Max assembly size: (X): 350 * (Y) 550mm10)Pick-placement precision: ±0.01mm11)Placement capability: 0805, 0603, 0402, 020112)High-pin count press fit available13)SMT capacity per day: 800,000 pointsAdvantages of PCB and PCB assembly:1)Strict product liability, taking IPC-A-160 standard2)Engineering pretreatment before production3)Production process control (5ms)4)100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC5)100% AOI inspection, including X-ray, 3D microscope and ICT6)High-voltage test, impedance control test7)Microsection, soldering capacity, thermal stress test, shocking test8)In-house PCB production9)No minimum order quantity and free sample10)Focus on low to medium volume production11)Quick and on-time deliveryPCB/PCBA application:Our Certifciate:Our Exhibition:Welcome to send your any request to us!We will reply you in 24hours !
