Stm32 IC Arm Core Chip Electronic Component Spare Parts

Product Name: Stm32 IC Arm Core Chip Electronic Component Spare Parts Model NO.: STM32F407VET6 Type: Digital / Analog IC Technics: Semiconductor IC Integration: GSIC Conductive Type: Unipolar Integrated Circuit Application: Standard Generalized Integrated Circuit shape: Flat Category: IC Product: St IC Trademark: ST Transport Package: Carton Specification: ARM Core Origin: China Product Description The STM32F405xx and STM32F407xx family is based on the high-performance ARM® Cortex™-M4 32-bit RISC core operating at a frequency of up to 168 MHz. The Cortex-M4 core features a Floating point unit (FPU) single precision which supports all ARM singleprecision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security. The Cortex-M4 core with FPU will be referred to as Cortex-M4F throughout this document. The STM32F405xx and STM32F407xx family incorporates high-speed embedded memories (Flash memory up to 1 Mbyte, up to 192 Kbytes of SRAM), up to 4 Kbytes of backup SRAM, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix. CategoryICPNSTM32F407VET6All devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers. a true random number generator (RNG). They also feature standard and advanced communication interfaces.Our Advantages:1, The first to introduce aerospace system quality control standard.2, No limit to MOQ, meet different customer demands by all means.3, Speedy delivery! Punctual, Fast! Make sample in 24h, small and medium volume production for 3-5 days, mass production for 9-12 days.4, Preferred SMT factory in Science Park with public praise of high quality and customer loyalty over ten years.5, Take charge of PCB production, SMT processing, procurement of components, tests and general assembly.6, Long-term partners cover Lenovo, HUAWEI, China Mobile and some military units.7, Reduce cost for you! Excellent and speedy one-stop manufacturing service will save time, trouble and money for you.8, Sophisticated SMD my data and accurate AOI are tailor-made for high-end products.9, Through 36 test procedures of TUV, product percent of pass is 99.97%.10, Strong senior engineering team will build a firewall of quality problems.Ability ShowPCB Layout / PCB DesignOur dedicated team provides high quality PCB design service for more than 5,000 customers, such as Intel, Cisco, Huawei, Freescale, TI, Lenovo, etc. in the past 15 years. We have 50+ PCB designers located in our offices in Shenzhen, Beijing, Shanghai, doing PCB layout for customers from all over the world. We constantly strive to further our technological capabilities, and are now working on DDR4 and 25Gbps+ backplane signal design and simulation.I Advantages 1. Experienced experts providing high quality work; 2. Large team with excellent customer service; 3. Independently developed software to enhance design efficiency; 4. Keep up-to-date with technology;II PCB Layout Business Model 1. PCB Design Total Solution: PCB footprint creation, Netlist import, Placement, Routing, QA & Review, DFM checking, Gerber out; 2. On-site Service: work together with your engineers in your office; 3. Consulting and Training: provide consulting and training services of PCB design;Physical ParametersHighest layers: 42 LayersMaximum PIN count: 69000+Maximum connections: 55000+Minimum line width: 2.4milMinimum line spacing: 2.4milMinimum via: 6mil(4mil laser hole)Maximum BGA in a single PCB: 62Maximum BGA PIN spacing: 0.4mmMaximum BGA PIN count: 2597Highest speed signal: 10G CMLInvolved Chipset SchemeNetwork processor series:IXP2400 IXP2804 IXP2850…Intel Sandy Bridge series: Intel Core i7 Extreme Core i5…Intel XEON server series: Xeon® E7 Family® 5000 Sequence…Marvell series:MX630 FX930 FX950…Broadcom Sonet /SDH series:BCM8228 BCM8105 BCM8129…Broadcom Gigabit Ethernet switch series:BCM5696 BCM56601 BCM56800…QUALCOMM/Spread trum /MTK platform:QSC60xx SC88xx SC68xx Mt622x…Freescale PowerPC series:MPC8541 MPC8548 MPC8555 MPC8641…FPGA DSP series of chips:Virtex-7 Spartan-6 TMS320C5X…Backplane, High-Speed PCB design, A/D PCB design, HDI/ALIVH/Buried resister/Buried capacitance,Flex PCB/Rigid-Flex Board, ATE ;High Speed and High density PCB Design for IT Communication, Computer, Medical, Digital and consumerPCB Main Capabilities:Layer Count: 2L~64LMax.Board Thickness: 10mmMin. Trace Width/Space: Inner 2.5/2.5mil, Outer 3/3milTrace Width/Spacing Tolerance: ±20%; ±10% for signal trace areas by special controlMax. Copper Weight: 12oz (Inner/Outer Layer)Min. Drilling Size: Mechanical 0.15mm, Laser 0.1mmMax. Unit PCB Size: 800mmX520mmMax. Delivery Panel Size: 1200mm×570mmMax. Aspect Ratio: 18:1Surface Finish: LF-HASL, ENIG, Imm-Ag, Imm-Sn, OSP, ENEPIG, Gold Finger etc.Impedance Tolerance: ±8%Special Materials:1, Lead-free/Halogen-free: EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF;2, High Speed: Megtron6, Megtron4,Megtron7,TU872SLK,FR408HR,N4000-13 Series,MW4000,MW2000,TU933;3, High Frequency: Ro3003, Ro3006, Ro4350B,Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27;4, FPC Materials: Polyimide, Tk, LCP, BT, C-ply,Fradflex, Omega , ZBC2000.High Layer Count PCB Features:High layer count PCBs, widely found in file servers, data storage, GPS technology, satellite systems, weather analysis and medical equipment are usually ≥12L with special performance requirement raw material.FPC Main Capabilities:1. Single side/Double side, Multilayer(6 layers or below)2. Roll to Roll manufacturing, enable the ability of handling thin base material3. 0.035mm small via4. 0.035/0.035mm trace width/space design5. From SMT to adhesive dispensing, ICT to FCT, assembly & Test full process capability, One-stop shop service for our customers6. 5G FPC Simulation/Manufacturing/Test One-stop shop serviceFlex-rigid PCB Main CapabilitiesStandard Panel Size: 500x600mmCopper Thickness: 6 OZFinal Thickness: 0.06-6.0mmLayer Count: Up to 20LMaterial: PI, PET, PEN, FR4, PIMin Line Width/Spacing: 3/3milMin Drill Hole Size: 6mil Min Via Size: 4mil (Laser)Min Micro Via Size: 4mil (Laser)Min Slot Size: 24milx35mil(0.6x0.9mm)Min Hole Ring:Inner 1/2OZ 4mil (0.10 mm)Inner 1OZ 5mil (0.13 mm)Inner 2OZ 7mil (0.18mm)Outer 1/3-1/2OZ 5mil (0.13 mm)Outer 1OZ 5mil (0.13 mm)Outer 1OZ 8mil (0.20mm)Stiffener:Stiffener Material Polyimide/FR4PI Stiffener Registration 10mil (0.25mm)PI Stiffener Tolerance 10%FR4 Stiffener Registration 10mil (0.25mm)FR4 Stiffener Tolerance 10%Coverlay Color: White, Black, Yellow, TransparentSurface Finish:ENIG Ni: 100-200μ'', Au: 1-4μ''OSP 8-20μ''Immersion Silver Silver: 6-12μ''Gold Plating Ni: 100-200μ'', Au: 1-15μ''Outline Tolerance of Punch:Precision Mould +/-3mil (0.08 mm)Ordinary Mould +/-4mil (0.10 mm)Knife Mould +/-9mil (0.23 mm)Hand Cutting +/-16mil (0.41 mm)Electrical Test Voltage: 50-300Vmetal base PCBs Capabilities:Max. Layer: 1-10 layersMax. Board Thickness: 4.0mmMax. Delivery Panel Size: 740mm x 540mmMax. Copper Weight: 6oz (Inner/Outer Layer)Drilling Size on Aluminum base: Max. 6.4mm, Min. 0.55mmDrilling Size on Copper base: Max. 6.0mm, Min. 0.6mmMax. Breakdown Voltage: 6000V/ACHeat Dissipation Performance: 12W/m.Kmetal base Material Type: Copper/Aluminum/Stainless Steel/IronHDI High Density Interconnect PCB Main CapabilitiesHDI Layer Count: 4L-32L mass production, 34L-64L quick-turnMaterial: High Tg material (Recommend Shengyi Material)Finished Board Thickness: 0.8-4.8mmFinished Copper Thickness: Hoz-8ozMax. Board Size: 600x800mmMin. Drilling Size: 0.15mm, 0.1mm(laser drilling)Blind/Buried vias depth ratio: 1:1Min. Line Width/Space inner: 2/2mil, outer 3/3milSurface Finish: ENIG, Immersiong Silver, Immersion Sn, Plated Gold, Plated Sn, OSP ect.Standard: IPC Class 2, IPC Class 3, MillitaryApplication: Industrial, Automotive, Consumer, Telecom, Medical, Military, Security ect.Blind&Buried Structure: 3+N+3 to any layerMass SMT Main CapabilitiesLayer Count: 1Layer - 30Layer PCBMax PCB size: 510x460mmMin. PCB size: 50x50mmBoard thickness: 0.2-6mmMin. Components size: 0201-150mmMax. Components size: 25mmMin. lead pitch: 0.3mmMin. BGA ball pitch: 0.3mmPlacement precision: +/-0.03mmOther: Laser cut for Stencil manufacture for manual, semi-automatic and fully automatic solder print machine, the accuracy can be 5um.FAQQ: What service do you have?A: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal, final assembly, testing and other value-added service.Q: What is your minimum order quantity (MOQ)?A: As for MOQ, we have no request about it. Even 1 pcs is ok for us.Q: What is needed for PCB & PCBA quotation?A: For PCB: Quantity, Gerber file and technic requirements (material, size, surface finish treatment, copper thickness, board thickness). For PCBA: PCB information, BOM, Testing documents.Q: How to keep our product information and design file secret?A: We are willing to sign the NDA effect by customers side local law and promising to keep customers data in high confidential level.Q: What are the main products of your PCB/PCbaservices?A: Automotive, Medical, Industry Control, IOT, Smart Home, Military.Q: Are you factory?A: Yes, our office address is located in Room 515 Jiurun Business Building No. 1658 Husong Road Songjiang District Shanghai, Shanghai, ChinaSincerely, wish we have the honour to serve for you. I promise you will be satisfied with our products and services.Maybe we don't have the lowest price, but can guarantee you the best quality.If you are interested, welcome to contact us. Here is the contact information as follows:Shanghai Gawin Electronic Technology Co., Ltd.Web: www.gawin-tech.com