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Product Name: Rigid-Flex Printed Circuit Board with Flexible PCBA Manufacturing Model NO.: PCB Brand: FL Insulation Materials: Organic Resin base Material: Fr4+Pi Processing Technology: Electrolytic Foil Mechanical Rigid: Rigid +Flex Flame Retardant Properties: V0 Application: Medical Instruments Material: Fiberglass Epoxy Dielectric: Fr4+Pi Type: Rigid Circuit Board Board Material: Fr4+Pi Board Thickness: 1.6mm Copper Thickness: 1oz Surface Treatment: Immersion Gold Product Name: PCB Manufacturer Immersion Gold 8L Rigid Flex PCB Package: Carton + Vacuum Small Order: 1 PCS Trademark: Fastline Transport Package: Vacuum+Carton Packing Specification: UL, SGS, ROHS Origin: China HS Code: 853400900 Product Description Rigid-flex printed circuit board with flexible pcba manufacturingHi buyer,Thank your for scanning our Rigid-Flex PCB Products.As is known,PCB is customized product ,so the unit price is not real,details pls contact me and aquotation will be offered.Please send usPCB files in gerber files, ".pcbdoc", ".lay", ".lay6" or ".brd".Product DescriptionStandard Flex Materials:Polyimide (Kapton) 0.5 mil to 5mils (.012mm -.127mm)Adhesiveless Copper Clad base Material 1mil to 5milsFlame Retardant Laminate, base Material, and CoverlayHigh Performance Epoxy Laminate and PrepregHigh Performance Polyimide Laminate and PrepregUL and RoHS Compliant Material on requestHigh Tg FR4 (170+ Tg), Polyimide (260+ Tg)base Copper:1/3 oz. -.00047 in. (.012mm)--rarely used1/2 oz. -.0007 in. (.018mm)1 oz. -.0014 in. (.036mm)2 oz. -.0028 in. (.071mm)Solder Mask:Polyimide Coverlay: 0.5 mil to 5mils Kapton (.012mm -.127mm)with 0.5 to 2mil Adhesive (.012mm -.051mm)LPI and LDI Flexible SoldermasksRigid-Flex PCB CapabilityFastline FPC board and Rigid-flex PCB capabilityTechnology and CapabilitiesMaterialPolyimide /PolyesterCountsFlex: 1~8L; Rigid-Flex: 2~8LBoard ThicknessMin.0.05mm ; Max. 0.3mmCopper Thickness1/3 oz --- 2ozMaximum dimensionsFor FPC:250mm*1200mm(normal); 250mm*100,000mmCNC Drill Size (Max)6.5mmCNC Drill Size (Min)Flex: 0.15mmHoles Location Tolerance±0.05mmCoverlay Drill Size (Min)0.6mmHole to Coverlay Opening Windows (Min)0.15mmMin Line Width /Spacing0.1/0.1mmAspect Ratio61Copper Thickness on Hole WallFlex:12-22μmMin Pad Sizeφ0.2mmEtch ToleranceFinished line width tolerance ±20%Pattern Registration Tolerance±0.1mm (Working Panel Size: 250*300mm)Coverlay Registration Tolerance±0.15mmSolder Mask Registration Tolerance±0.2mmSolder Mask to PADNon photosensitive: 0.2mmPhotosensitive: 0.1mmMin. Solder Mask Dam0.1mmMisregistration Tolerance for Stiffener, Adhesive, Glue paper±0.30mmSurface FinishPlating Ni /Au ;Chemical Ni /Au ;OSPWouldliketoknowmoreabouttheproduct?Sendusinquiry,click"Send"now!Please feel free to send us gerber file for lastest price and discount!Contact Person: Lily HeCellphone: 008618025363532
