Power Bank PCB Fr4 PCB

Product Name: Power Bank PCB Fr4 PCB Model NO.: SPCB-209 Brand: Semshine Model: FR-4 Insulation Materials: Epoxy Resin base Material: Copper Processing Technology: HASL Mechanical Rigid: Rigid Flame Retardant Properties: V0 Material: Fiberglass Epoxy Dielectric: FR-4 Type: Rigid Circuit Board Trademark: Semshine Transport Package: Standard Carton Packing Origin: Guangdong, China HS Code: 853400 Product Description DescriptionPCB SpecificationMaterialFR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum/PILayer1-20Board Thickness0.2mm-4.0mmBoard Thickness Tolerance+/-10%Copper Thickness17.5um-175um(0.5oz-5oz)Min Trace Width0.15mmMin Space Width0.15mmMin Drilling Dia0.2mmPTH copper thickness0.4-2mil(10-50um)Tolerance of Etching±1mil(±25um)V-cut angle25°,30°,45°,60°Pearl Strength of line≥6lb/in(≥107g/mm)Impedance control and tolerance50Ω±10%Twist & Wrap≤ 0.5%SoldermaskGreen, Red, Blue, White, Black, YellowSurface Finish / PlatingHASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIGCertificateROSH , ISO9001, UL CertificateFileProtel 99se/P-CAD/Autocad/Cam350Inner packingVacuum packing,Plastic bagOuter packingStandard carton packingDetailed Terms for PCB AssemblyQuantityPrototype&Low Volume PCB Assembly, from 1 Board to 250, is for specially, but we can handle orders up to 1000.Type of AssemblySMT and Thur-holeSolder TypeWater Soluble Solder Paste, Leaded and Lead-FreeComponentsPassives Down to 0201 Size;BGA and VFBGA;Leadless Chip Carries/CSP;Double-Sided SMT Assembly;Fine Pitch to 08 Mils;BGA Repair and Reball;Part Removal and Replacement-Same Day Service.Bare Board SizeSmallest 0.25×0.25 Inches;Largest 20×20 Inches.File FormatsBill of Materials;Gerber Files;Pick-N-Place File (XYRS).Type of ServiceTurn-Key, Partial Turn-Key or Consignment.Component PackagingCut Tape;Tube;Reels;Loose Parts.Turn TimeSame Day Service to 15 day service.TestingFlying Probe Test;XRAY inspection AOI Test.