详细说明
Product Name: PCB/Hot Products Copper Clad Laminate Sheet for PCB Circuit Model NO.: fr1 Brand: Hjh Insulation Materials: metal Composite Materials base Material: Copper Production Process: Laminateing Processing Technology: Delay Pressure Foil Flame Retardant Properties: HB Application: Consumer Electronics Material: Paper/Copper Foil Dielectric: FR-1 Structure: Single-Sided Rigid PCB Trademark: HJH Transport Package: Pallet Specification: Metri ton Origin: China HS Code: 7410211000 Product Description 1.FEATURES--Halogen-Free,friendly to the environment--The warpage and twist are small and stable --Suitable for punching at 40 ~70ºC 2.APPLICATIonMainly be used in household electronic and other electronicproducts with halogen-freerequests. 3.TECHNICAL DATA SHEETTest ItemUnitTest ConditionSpecificationTypical ValueSolder Resistance(260ºC)SecA≥1025~30Heat Resistance-130ºC30minNo ChangeNo ChangePeel Strength(Copper Foil 35µm)Kgf/cmA260ºC/10Sec≥1.21.7~2.01.6-1.8FlexuralLengthwiseKgf/mm²A≥815-17Crosswise≥814-15Volume ResistivityΩ-cmC-96/20/65C-96/20/65+C-96/40/905×1095×1081.0×1012~10131.0×1012~1013Surface ResistivityAdhesive SideΩC-96/20/65C-96/20/65+C-96/40/901×10101×1091.0×1011~10121.0×1010~1011Laminate SideC-96/20/65C-96/20/65+C-96/40/901×10101×1091.0×1010~10111.0×109~1010Insulation ResistanceΩC-96/20/65C-96/20/65+D-2/1001×1091×1061.0×1011~10121.0×108~109Chemical Resistance-3%NaOH 40ºC3minNo ChangeNo ChangeBoiled in trichloroethylene for 3minNo ChangeMoisture Absorption%E-24/50+D-24/23≤20.7~0.9FlammabilityRatingAUL94V-0V-0Dielectric Constant(1MHz)-C-96/20/65C-96/20/65+D-24/23≤5.54.0~5.0≤6.04.5~5.5Dissipation Factor-C-96/20/65C-96/20/65+D-24/23≤0.050.025~0.035≤0.10.045~0.055CTI Value V0.1% NH4CL≥175175/600Punching TemperatureºCA40-7040-7
