详细说明
Product Name: Manual Ultrasonic Thin Wire Wedge Bonding Machine Mdb2575 Model NO.: mdb-2575 Trademark: minder-hightech Transport Package: Plywood Packing by Fast Express Specification: 50kg Origin: Guangzhou HS Code: 8515809090 Product Description Application:COB,IC,Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.Specification: 1,electric requirement:220VAC±10%,50HZ,be sure connected to ground 2,wire diameter:25~75μm wedge bonding. 3,ultrasonic power:0-3W, two channel. can be set separately of the two point 4,bond time:5-200ms,two channel 5,bond force:10-60g,two channel 6, span between first bond to second bond by automatic mode:0-10mm(motorized) 7,bond radian: 0-6mm(motorized) 8, jig moving area: Φ16mm 9,mouse hand:20*20mm 10,digital camera: optional 11,dimension:600*560*390mm 12,weight:36kg------------------------------------------------------------------------------------------------------------------------------------------------------------guangzhou minder-hightech co.,ltdcontact:shunyu.hu cellphone0086-15813334038
