详细说明
Product Name: Manual Ultrasonic Gold Wire Ball Bonder Mdbb1750 Model NO.: MDBB-1750 Trademark: minder-hightech Transport Package: Plywood Packing by Fast Express Specification: 50kg Origin: Guangzhou HS Code: 8015809090 Product Description Application:LED, IC chips, diode, laser tube, the inner lead, semiconductor devices etc.Specification:1,electric requiement:220VAC±10%,50HZ,be sure connected to ground2,wire diameter:17~50μm3,ultrasonic power:0-3W, two channel. can be set separately of the two point 4,bond time:0-200ms,two channel5,bond force:35-180g,two channel6,digital camera systerm:optional7,min bonding time:0.4s/wire8,span between first bond to second bond by automatic mode: more than 4mm. 9,length of terminal wire: 0-2mm10,ball dimension:2-4 times bigger setable11,bond temperature: house temperature ~400°C12,jig moving area: Φ25mm13,microscope:15X,30x14,dimension:700*460*550mm15,weight:28kg------------------------------------------------------------------------------------------------------------------------------------------------------------guangzhou minder-hightech co.,ltdcontact:shunyu.hu cellphone//:0086-15813334038
