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Product Name: LED Related Copper Tungsten Heat Sink Model NO.: fotma Hole: Customized ET: Customized PCD: Customized Carbon Content: None Material: Wcu Product Type: Heat Sink Material Grade: Wcu W Content: 50% - 90% Cu Content: 10% - 50% Thickness: 0.5mm - 1.0mm OEM: Acceptable Trademark: FOTMA Transport Package: Plywood Boxes Specification: Customized Origin: P. R. China HS Code: 81019990 Product Description Tungsten Copper high performance composites are fabricated from carefully controlled porous tungsten that is vacuum infiltrated with molten copper. This results in a W/Cu composite that has high conductivity and a matched low thermal expansion for heat sinks. It is a composite of tungsten and copper. By controlling the content of tungsten, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Kovar, etc.AdvantagesHigh thermal conductivityExcellent hermeticityExcellent flatness, surface finish, and size controlSemi-finished or finished (Ni/Au plated) products availableHeat sinks are used to conduct heat away from computer chips and integrated circuits, preventing thermal damage. Depending on the electronic device, heat sinks come in different sizes and shapes. Tungsten-copper composites, with copper content (by weight) of 15 to 20 percent, are often used to make heat sinks. Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.Specifications of WCuAlloys:MaterialW90Cu10W88Cu12W85Cu15W80Cu20W75Cu25TungstenContent(wt%)90±188±185±180±175±1Densityat20°C(g/cm3)17.016.816.315.614.9Coefficientofthermalexpansionat20°C(10-6/K)6.56.77.08.39.0Materials(articlename)Composition[wt%]Densityat20°C[g/cm2]Coefficientofthermalexpansionat20°C[10-6/K]Thermalconductivityat20°C[W/(m·K)]MolybdenumMo99.97%10.222°C5.5/800°C5.7xyz142TungstenW99.95%19.322°C4.5/800°C4.8xyz165MoCuMo-30%Cu9.722°C7.1/800°C7.8xyz205WCuW-10%Cu17.122°C6.4xyz195WCuW-15%Cu16.422°C7.3xyz215WCuW-20%Cu15.522°C8.3xyz235Cu/Mo-30Cu/Cu(PMC)1:4:1/Mo-52%Cu9.4200°C9.0/800°C7.3xy280/z170Cu/Mo/Cu(CMC)1:1:1/Mo-66%Cu9.322°C8.3/800°C6.4xy305/z250Cu/Mo/Cu/.../Cu(S-CMC)5:1:5:1:5/Mo-87%Cu9.2200°C12.8/800°C6.1xy350/z295Product Show:
