High Precision on-Line 3D Spi Equipment for SMT I Rison I

Product Name: High Precision on-Line 3D Spi Equipment for SMT I Rison I Model NO.: RX-SPI80 Automation: Automation Certification: ISO, CE Camera: Full Digital High Speed CCD Camera, 5m Pix Fov: 32mm*32mm(20um) Speed&#160;Per&#160;Fov: <0.6s Speed: 700mm/S PCB Size: Min : 50mm*50mm Max : 330mm*250mm Trademark: RISON Transport Package: Wooden Packing Specification: 1565*1250*1565mm Origin: Shenzhen HS Code: 84798999 Product Description RX-SPI80 online Solder Paste InspectionPRODUCT FEATURE5 Mega pixel high resolution vertical&side camera,Effectively reducing shadow effect,enhancing accuracyOf measurement to paste coverage and thicknessUser friendly software interfaceFOV 32mm x 32mm,<0.60sec/FOVMixed long&short wave length Mollweide projection technologyOn screen display actual formed images4 color round shape light sourceHeight measurement accuracy in+-1umSMEMA upstream/downstream interfaceGerber file input compatibilityThe meaning of online SPIPRODUCT FEATURESSPI phase measurement technologyThe grating phase light source used, the distortion generated by different height planes, the detection head continuously moves in a certain direction, the camera takes photos at set time intervals, thereby obtaining a set of laser distortion data, and then calculating to obtain the test result.. Software control of the grating motion is realized, which avoids the mechanical devices necessary for the traditional piezoelectric ceramic motor (PZT) to drive the glass moiré grating, reducing mechanical wear and customer maintenance costs.16-bit grayscale resolution, up to 0.3 micron detection resolution, 2 orders of magnitude better than laser measurement accuracy, greatly improving the detection capability and scope of the device.In order to avoid poor printing during the test, 3D SPI detection is required.Solder judgment resultAreaVolumeICT2D inspection machineOK-NG3D inspection machineOKNG Self-developed software Self-developed 3D-SPI software PRODUCT FEATURES NameSPI Solder Paste Inspection MachineModelRX-3DSPI-80CameraFull digital high speed CCD camera, 5M Pix Light sourceRing LED light sourceFOV32mm*32mm(20μm)SpeedPerFOV<0.6sDetect typeSolder paste / Red glue pringting: Volume, Area, Height,Shape, Offset, Bridge, OverflowDefect typeNone, Offset, More, Less, Bridge, Tip, Collapse, Shape, Goldfinger, Insufficient height, Height excess, Overflow, Lack of glueHeightRange10~400umAreaRangeMin : 0.15mm×0.15mm Max : 10mm×10mmHeight detection accuracy1μmVolume/Area/HeightRepeatabilityonaCertificatedTarget<1μm@3sigmaGR&R<10%Operating systemWindows 7Recognition systemDual 3D Projection(Single optional)avoidshadow and reflectionOperation interfaceGraphical programming, easy to operate, can switch English, traditional, simplified systemInterface display2D/3D true color pictureMARK2 Marks/Board or 2 Marks/Array, support bad marksoftware programGerber, CAD data, Offlineprogram,BareBoardTeachSPC ChartAny time ChartHistogram / Control/ Compare ChartVolume, Area, Height, OffsetExportExcel , Jpg , BmpPCBTransmitSystemBottom-upfix;Autotransmitandwidth correctbasedonSMEMAHeight900±20mmPCB SizeMin : 50mm×50mm Max : 330mm×250mmPCB Thickness0.3mm~4.5mmMax PCB Warp<2mmMotionAC servo motor systemX, Y platform position accuracy<1μmSpeed700mm/sPower supplyAC220V 50/60Hz,1200WAir pressure0.4~0.8MpaBarcode scanning functionCamera direct scanning, optional external barcode gunDimensions1565×1250×1565mm (L×W×H) does not include the height of the signal lightEquipment weight900KGFor further information please feel free to contact me.http://www.rison-aut.com/en/Self-developed software