High Precision Ceramic Metallization Ceramic Tube

 
 
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更新 2020-09-06 21:22
 
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Lianyungang Zhong Ao Aluminium Co., Ltd.

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Product Name: High Precision Ceramic metallization Ceramic Tube Model NO.: ZALY Type: Wear Resistant Ceramic Material: Aluminum Application: Loader, metallurgical Machinery, Cement Plant, Mining Machine, Thermal Power Plant, Coal Yard Standard: GB Ceritificates: ISO, SGS Mohs Hrdness: 9 Trademark: ZALY Transport Package: Wooden Box Specification: custom made Origin: Lianyungang, Jiangsu, China HS Code: 69091900 Product Description High Precision Ceramic metallization Ceramic Tube1) Good insulation performance2) High temperature application3) High power4) CustomizedIn high-temperature state, ceramic and metal make the vacuum-completely-tight joint with the advantage of high mechanical strength and exellent thermostability. It is made of various fine hard joining material such as gold, silver copper which makes the equipment work in desirable performance and the new property is generated as well. We makes hermetic ceramic-to-metal joints possible with extremely high bond strengths exceeding 200 N/mm².The product can be used for gas discharging equipment, or as high & low tension vacuum switch in electric powder and electrified wire, or as freely-controlled silicon elements, potentiometer basilar-plate, refrigerator-basilar plate, electric resipowder electron, metallurgy, machinery, aerospace and aviationApplications:Electrical transmission and distributionElectronics industryTextile machineryDefenseMedical electronicsAutomobile industryAvionicsSolid Oxide Fuel CellsWhite goodsHigh power/High temperature applicationNo.ItemIndex1Thickness of metal layerMo-Mn , 8 μm MinNi: 2 μm Min2Bonding strength>650N/ cm 23SolderabilityTemperature for soldering tin: 235±5°C dip time lasts 5 second, fresh, glossy and connective solder covered on more than 95% area of bonding pad.4Resistance of solderabilityTemperature for soldering tin: 260 ±5°C dip time lasts 20 seconds, fresh, glossy and connective solder covered on more than 95% area of bonding pad.
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