| PCB Manufacturing Capabilities: | |
| Layers | 1-20 Layers |
| Laminate | FR4, H-TG, CEM, Aluminum, Copper base, Rogers, |
| Ceramics, Iron base | |
| Max. Board Size | 1200*480mm |
| Min.Board Thickness | 2-Layer 0.15mm |
| 4-Layer 0.4mm | |
| 6-Layer 0.6mm | |
| 8-Layer 1.5mm | |
| 10-Layer 1.6-2.0mm | |
| Min. Line Width/Trace | 0.1mm(4mil) |
| Max. Copper Thickness | 10 OZ |
| Min. S/M Pitch | 0.1mm(4mil) |
| Max. S/M Pitch | 0.2mm(8mil) |
| Min. Hole Dia. | 0.2mm(8mil) |
| Hole Dia. Tolerance(PTH) | ±0.05mm(2mil) |
| Hole Dia. Tolerance(NPTH) | ±0.05mm(2mil) |
| Hole Position Deviation | ±0.05mm(2mil) |
| Outline Tolerance | ±0.1mm(4mil) |
| Twist/Bent | 0.75% |
| Insulation Resistance | >1012Ω Normal |
| Electric Strength | >1.3kv/mm |
| S/M Abrasion | >6H |
| Thermal Stress | 288ºC 10Sec |
| Test Voltage | 50-300V |
| Min. Blind/Buried Via | 0.15mm(6mil) |
| Surface Treatment | OSP,HASL,LF-HASL,ENIG,Gold/Au Plating,Immersion Ag/Silver, |
| Ag/Silver Plating,Immersion Tin,Tin Plating | |
| Testing | E-test, Fly probe test |
