Electric and Electronics Ceramics Circuit Boards Ceramics Metallization Substrate

Product Name: Electric and Electronics Ceramics Circuit Boards Ceramics metallization Substrate Usage: Textile, Chemical Industry, Electron, Electrical Appliance, Construction, Hygienic Making Method: Machine Made Function: Thermostability, Thermal Insulation, Structral Style: Classical Theme: Industrial Technique: Dry Press, CIP, Hip, Cim Raw Material: Aln/Al2O3/Zro2 Material: Ceramics Type: Electric and Electronics Trademark: yinghua Origin: China HS Code: 8534001000 Product Description Ceramic circuit boards are actually based on electronic ceramics, include the material of Alumina Nitride (AlN), Alumina (Al2O3), BeO, Quartz , Sapphire, Silicone Carbide(SiC), Silicone Nitride(Si3N4), Yttria(Y2O3)or Magnesia(MgO) partially stabilized Zirconia(Y-PSZ/Mg-PSZ),can be made of various shapes. Among them, the ceramic circuit board has the most outstanding characteristics of high temperature resistance and high electrical insulation performance. It has the advantages of low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability and close to the thermal expansion coefficient of the components. The fabrication of ceramic circuit board will use LAM technology, that is, laser fast activation metallization technology. Applications in the field of LED, high power semiconductor modules, semiconductor refrigerators, electronic heaters, power control circuits, power hybrid circuits, intelligent power components, high frequency switching power supplies, solid state relays Automotive electronics, communications, aerospace and military electronic components.Ceramic materials have excellent high frequency and electrical properties, high thermal conductivity, excellent chemical stability and thermal stability, etc. It is an ideal packaging material for new generation large scale integrated circuits and power electronic modules.1. Higher thermal conductivity2. More matching coefficient of thermal expansion3. A firmer, less resistive metal film.4. The solderability of the substrate is good and the use temperature is high.5. Good insulation6. Low loss at high frequency7. High density assembly8. Free of organic components, cosmic ray resistant, high reliability in aerospace, long service life9. Copper layer does not contain oxide layer, can be used in reductive atmosphere for a long timeITEM123456789Y-TZPMgO-PSZAl2O3Si3N4SiCAlNBNBeO1(%)ZrO2Y2O3ZrO2MgOAl2O3Al2O3/////Chemical Composition94.65.296.53.599.696/////2WhiteYellowIvoryWhiteGrayBlackGrayWhiteWhiteColor3(g/cm3)6.05 5.70 3.90 3.70 3.20 3.20 3.26 2.00 2.90 Density4(%)0 0 4.90 0 0 0 0 0 0 Water Absorption5999 8.8 99.59.52/Hardness Mohs6(Kg/mm2)1300 1100 1850 1400 1600 2200 1200 /1200 Hardness Vickers7(Gpa)200 250 360 300 300 440 300 //Young's Modulus8(MPa)1250 450 400 300 720 450 300 35 220 Bending Strength9(Mpa*M1/3)10.0 6.5 4.5 3.0 7.0 3.9 3.3 //Fracture Toughness10(MPa)3000 2500 2500 2000 2500 1800 2100 //Compressive Strength11(10-6/K)10.0 10.0 7.5 7.5 3.2 3.0 3.5 1.0 8.0 Expansion Coefficient12(W/mK)3 3 30 20 20 120 >17075 280 Thermal Conductivity1320.0 28.0 9.8 9.0 8.3 9.7 9.0 4.0 7.0 Dielectric Constant14(Ω·Cm)>1012>1014>1015>1014>1014>103>1014>1014>1013Volume Resistivity