详细说明
Product Name: Automatic Aluminum Wire Bonding Machine MD-Etech1850 Model NO.: MD-ETECH1850 Trademark: minder-hightech Transport Package: Plywood Packing by Sea Specification: 350kg Origin: Guangzhou HS Code: 8015809090 Product Description Specification:Application: LED,COB,Integrated circuit,Semiconductor, digital tube, lattice,Wire diameter:0.7mil-2.0milXY travel:4''*4''Z travel:0.4''Resolution:0.02milBonding angle:30 degreeBonding force:15-200gBonding power:0-2wBonding time:programmableBonding head clearance:4.8mmUPH:14K(based on 2mm wire length)Alignment Reference:Die: 0.1 or 2points;Substrate:0.1 or 2pointsImage recognition systemOptical microscope:10-30XVoltage:110v/220v 50HzPower:800wProgram storage:1000wires/chip,1000chips/program,99programsDimension:760*820*1450mmWeight:280kg-----------------------------------------------------------------------------------------------------------------------------------------------------------Related video:scan the bonding pad:https://youtu.be/22rL4jlBxOYMD-Etech1850 show bonding result and screen resolution:https://youtu.be/mt3eBfOAoiYMD-Etech1850 show full bonding process:https://youtu.be/AkLb5dNMdlEMD-Etech1850 when bonding, screen will not change:https://youtu.be/C_zPXRKOZIo------------------------------------------------------------------------------------------------------------------------------------------------------------guangzhou minder-hightech co.,ltdcontact:shunyu.hu cellphone:0086-15813334038
